Journal Papers

Jesus N. Calata, John G. Bai , and Guo-Quan Lu , “Three-Dimensional Packaging for Power Semiconductor Devices and Modules,” IEEE Transactions on Advanced Packaging 28 (3) 404-412, August, 2005.

J. G. Bai, Z. Z. Zhang, G-Q. Lu , and D. P. H. Hasselman, “ Me asurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique,” International Journal of Thermophysics 26 (5) 1607-1615, September, 2005.

C. Xu, Y.C. Lin, X. Liu, and G-Q. Lu , “Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability,” Engineering Fracture Mechanics 72 2628–2646, 2005.

G-Q. Lu, S. Wen, X. Liu, J.N. Calata, and J.G. Bai, "Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices," Soldering & Surface Mount Technology (SSMT), 16 (2) 27-40 (2004).

Y.C. Lin, X.Chen, X. Liu, and G-Q. Lu, “Effect of Substrate Flexibility on Solder Joint Reliability. Part II: Finite Element Modeling,” Journal of Microelectronics Reliability, 45, 143-154 (2004).

S. Dong, J.G. Bai, J. Zhai, J-F. Li, G-Q. Lu, D. Viehland, S. Zhang, and T.R. Shrout, “Circumferential-mode, Quasi-ring-type, Magnetoelectric Laminate Composite—a Highly Sensitive Electric Current and/or Vortex Magnetic Field Sensor,” Appl. Phy. Lett. 86, 182506 (2005).

J. Bai, G-Q. Lu, and X. Liu, "Flip-chip on Flex Integrated Power Electronics Modules for High-density Power Integration," IEEE Transactions on Advanced Packaging, 26 (1) 54-59, 2003.

J. Bai, G-Q. Lu, and T. Lin, "Magneto-optical Current Sensing for Applications in Integrated Power Electronics Modules," Sensors and Actuators A, 109, 9–16, 2003.

X. Liu, S. Xu, G-Q. Lu, and D.A. Dillard, "Effect of Substrate Flexibility on Solder Joint Reliability," Journal of Microelectronics Reliability, 42 [12] 1883-1891 (2002).

Z. Zhang and G-Q. Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow," IEEE Transactions on Electronics Packaging Manufacturing, 25 [4] 279-283, October 2002.

Conference Proceedings

G-Q. Lu , J.N. Calata, G. Lei, and X. Chen, “Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices,” Proceedings of 8th International Conference on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2007 , pp. 609-613, April 15 th – 18 th , 2007; London, UK.

J. Bai, Z.Z. Zhang, J.N. Calata, and G-Q. Lu , “Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection,” Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition , IMEC2005-79187, pp. 1-10, November, 2005. ( Orlando , Fl.)

J. Bai, Z. Zhang, J.N. Calata, and G-Q. Lu , “Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices,” Proceedings of the Seventh IEEE CPMT Conference on High-density Microsystem Design and Packaging and Failure Analysis (HDP'05), pp.272-276, Shanghai, PR China, June 27 th to June 30 th , 2005. (Invited Paper)

J. G. Bai, J. N. Calata, Z. Zhang, and G. Q. Lu ,, "Low-temperature sintered nanoscale silver joints for high-temperature power electronics packaging applications." Proceedings of Power Electronics Technology Exhibition & Conference , Baltimore , MD , Oct. 25-27, 2005.

Gustina B. Collins, Guo-Quan Lu , and Sanjay Raman, “ Hermetic Micro-packaging using Indium and Silver for High Power MEMS Devices,” 2006 CPES Power Electronics Conference Proceedings , pp 1-4, Virginia Tech, April 23 - 25, 2006.

Jesus N. Calata, Guangyin Lei, Guo-Quan Lu , and Carlos T. A. Suchicital , “ Processing of Multiferroic Barium Titanate-Ferrite Nanocomposite,” 2006 CPES Power Electronics Conference Proceedings , pp 1-6, Virginia Tech, April 23 - 25, 2006.

Mo. Wu, Guo-Quan Lu , Jian Yin, J. D. van Wyk, Yi Wang and T. Paul Chow, “ Thermal modeling and electrical analysis of the Nano-silver paste Die-attached Power Device Package at high temperature,” 2006 CPES Power Electronics Conference Proceedings , pp 1-4, Virginia Tech, April 23 - 25, 2006.

J.G. Bai, Z. Zhang, J.N. Calata, G-Q. Lu, and D.P.H. Hasselman "Determination of Interfacial Thermal Resistance by Finite-Element Analysis of the Flash Measurements," Proceedings of 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), pp 389-393, May, 2004.

Z. Zhang, J.N. Calata, C. Suchicital, G-Q. Lu, and D.P.H. Hasselman, “Comparison of the Thermal Interfacial Resistance Contribution from Silver and Solder Die-Attach Using Laser Flash Technique,” Proceedings of 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), pp.45-49, May, 2004.

K. Stinson-Bagby, D. Huff, D. Katsis, G-Q Lu, J.D. van Wyk, “Thermal Performance and Microstructure of Lead versus Lead-free Solder Die Attach Interface in Power Device Packages,” Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment, pp. 27-32, Phoenix/Scottdale, Arizona, May 10th – 13th, 2004.

Z. Zhang and G-Q. Lu, “Low-temperature Sintering of Silver Paste as a Viable Die-Attach Solution for High-Temperature Packaging,” Proceedings of IMAPS International Conference on High Temperature Electronics (HiTec 2004), Santa Fe, NM, May 17th to 20th, 2004.

Y. Xu, T. Lei, K. Linares, D. Flemming, K. Meehan, G-Q. Lu, N. Love, B. Love, “Maximizing Surface Enhanced Fluorescence via Tailoring the Dimensions and Spatial Distribution of Gold Nanoparticles,” in Proceedings of SPIE Symposium, November, 2004.

G. Collins, S. Raman, and G-Q. Lu, “Conformal, Hermetic Micro-packaging using Indium and Ag-Nano-particle bonding for RF MEMS Devices,” in Proceedings of the 37th International Symposium on Microelectronics, Long Beach Convention Center, Long Beach, CA, November 14-18, 2004.

J.N. Calata, G-Q. Lu, and C. Suchicital, “Multifunctional Ferroelectric-Ferrite Nanocomposite Material for Integrated Passive Components,” 2005 CPES Power Electronics Conference Proceedings, pp 13 - 19, Virginia Tech, April 17-20, 2005.

Z.Z. Zhang, J. Bai, G-Q. Lu, J. Yin, J.D. van Wyk, Z. Liang, L. Zhu, and T. P. Chow, “Low-Temperature Sintering Nanoscale Silver Paste as an High-Temperature Packaging Solution,” 2005 CPES Power Electronics Conference Proceedings, pp 20 - 24, Virginia Tech, April 17-20, 2005.

J. Bai, Z.Z. Zhang, J.N. Calata, and G-Q. Lu, “Characterization of Low-Temperature Sintered Nanoscale Silver as a Novel Power Device Interconnect Material,” 2005 CPES Power Electronics Conference Proceedings, pp 181 - 185, Virginia Tech, April 17-20, 2005.

J. Bai and G-Q. Lu, “Low-Temperature Sintered Nanoscale Silver Interconnection for Chip-Scale Packaging,” 2005 CPES Power Electronics Conference Proceedings, pp 186 - 190, Virginia Tech, April 17-20, 2005.

G.B. Collins, G-Q. Lu, S. Raman, “Conformal, hermetic Micro-Packaging Using Indium and Silver for Sealing High Power MEMS Devices,” 2005 CPES Power Electronics Conference Proceedings, pp 191 - 194, Virginia Tech, April 17-20, 2005.

J.G. Bai, J.N. Calata, and G-Q. Lu, "Comparative Thermal and Thermomechanical Analyses of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability," Proceedings, 2004 Applied Power Electronics Conference, 1240-1246, Anaheim, Calif., February 22-26, 2004.

Z. Zhang, J.G. Bai, J.N. Calata, G-Q. Lu, and D.P.H. Hasselman, "Comparison of the Interfacial Thermal Resistance Contribution From Silver and Solder Die-attach Using Laser Flash Tecnique," 2004 CPES Power Electronics Seminar Proceedings, 81-85, Virginia Tech, April 18-20, 2004.

D. Huff, K. Stinson-Bagby, G-Q. Lu, and J.D. van Wyk, "Reliability and Microstructure of Lead-free Solder Die Attach Interface in Silicon Power Devices," 2004 CPES Power Electronics Seminar Proceedings, 86 - 92, Virginia Tech, April 18-20, 2004.

J.G. Bai, J. N. Calata, and G-Q. Lu, "Comparative Thermal and Thermomechanical Analyses of Solder-bump and Direct-solder Bonded Power Device Packages Having Double-sided Cooling Capability," 2004 CPES Power Electronics Seminar Proceedings, 147 - 153, Virginia Tech, April 18-20, 2004.

J.G. Bai, G-Q. Lu, D. Borojevic, and T.M. Janhs, "Thermomechanical Analysis on the Embedded Power Integrated Power Electronics Modules," 2004 CPES Power Electronics Seminar Proceedings, 557 - 565, Virginia Tech, April 18-20, 2004.

Z. Zhang, J.G. Bai, J. N. Calata, and G-Q. Lu, "Nano-size Silver Paste for High-temperature Packaging of Semiconductor Devices," 2004 CPES Power Electronics Seminar Proceedings, 574 - 577, Virginia Tech, April 18-20, 2004.

Z. Zhang, J.N. Calata, J.G. Bai, and G.-Q. Lu, "Nanoscale Silver Sintering for High-Temperature Packaging of Semiconductor," Proceedings of TMS’ 04, 129-135, Charlotte, N.C., 2004.

J.N. Calata, J. G. Bai, G-Q. Lu, and C. Luechinger, "Evaluation of the Reliability of Interconnect Technologies for Power Semiconductor Devices," Proceedings, 2003 CPES Annual Seminar, Virginia Tech, 172-181, April 27-29, 2003.

J.G. Bai, G-Q. Lu, J.N. Calata, and T. Lin, "Potential Application of Magneto-optical Current Sensing in Power Modules," Proceedings, 2003 CPES Annual Seminar, Virginia Tech, 468-474, April 27-29, 2003.

D. Huff, D. Katsis, G-Q. Lu, and J.D. van Wyk, "A Comparison of Lifetime and Thermal Performance of Lead-free Solder Alloys for Bonding Power Devices in a Flux-less Reflow Process," Proceedings, 2003 CPES Annual Seminar, Virginia Tech, 499-506, April 27-29, 2003.

Z. Zhang, J.N. Calata, and G-Q. Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as a Die-Attach Approach," Proceedings, 2003 CPES Annual Seminar, Virginia Tech, 525-529, April 27-29, 2003.

G-Q. Lu, X. Liu, S. Wen, J.N. Calata, and J. Bai, "Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices," Proceedings of the 5th International Congress on Thermal Stresses and Related Topics (TS2003), pp. TA-4-4-1 to TA-4-4-4, Virginia Tech, June 8–11, 2003.

D. Huff, D. Katsis, K. Stinson-Bagby, G-Q. Lu, and J. D. van Wyk, "Thermal Performance and Microstructure of Lead-free Solder Die Attach Interface in Power Device Packages," Proceedings, 2003 IMAPS Annual Meeting, Boston, Mass., December 2003.

J. Calata, G-Q. Lu, and C. Luechinger, "Evaluation of Interconnect Technologies for Power Semiconductor Devices," Proceedings, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1089-1096, San Diego, May 30-June 1, 2002.

S. Wen, Z. Liang, F.C. Lee, and G-Q. Lu, "Thermal Performance of a Power Electronics Module Made by Thick-Film Planar Interconnection of Power Devices," Proceedings, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1097-1101, San Diego, May 30-June 1, 2002.

G-Q. Lu, J. Calata, S. Wen, S. Dutta, Y. Zheng, C. Stahl, and P. Shu, "Packaging of Large-Area, Individually Addressable, Micro-mirror Arrays for the Next Generation Space Telescope," Proceedings, International Conference on Microfabrication, Integration, and Packaging of MEMS, France, 521-530, May 6-10, 2002.

Z. Zhang and G-Q. Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow," Proceedings, Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP ’02), Shanghai, PR China, 41-44, June 30-July 3, 2002.

Z. Zhang and G-Q. Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 445-449 (2002).

J. Calata, G-Q. Lu, and C. Luechinger, "Evaluation of Interconnect Technologies for Power Semiconductor Devices," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 96-105 (2002).

J. Bai, J.B. Witcher, G-Q. Lu, and X. Liu, "Flip-Chip on Flex Power Modules for Automotive Application," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 422-427 (2002).

K. Stinson-Bagby, D. Datsis, G-Q. Lu, and D.J. van Wyk, "A Failure Analysis Study of Semiconductor Power Device Construction," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 85-89 (2002).

A.O. DiBiccari, G-Q. Lu, P.G. Duncan, and S.M. Christian, "Processing and Characterization of Magneto-Optic Rare Earth Substituted Yttrium Iron Oxide," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 342-345 (2002).

S. Wen, D. Huff, and G-Q. Lu, "Fast Power-Cycling Test of Area-Array Interconnected Power Devices," Proceedings, 2002 CPES Annual Seminar, Virginia Tech, 456-460 (2002).

Invited Presentations & Papers

G-Q. Lu, “Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices,” session keynote presentation at the 8th International Conference on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2007 , April 15 th – 18 th , 2007; London , UK

G-Q. Lu , “ Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules ,” session invited presentation at 2006 Asian Pacific Conference for Fracture and Strength (APCFS'06) , Nov. 22 – 25, 2006. Sanya, Hainan , China .

G-Q. Lu, J.N. Calata, Z. Zhang, and J. Bai, “A Lead-Free, Low-Temperature Sintering Die-Attach Technique for High-Performance and High-Temperature Packaging,” Proceedings of High-density Microsystem Design and Packaging and Component Failure Analysis (HDP’04), pp.42-46, Shanghai, PR China, June 30th to July 3rd, 2004. (Invited Paper)

G-Q. Lu, "Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices," Invited Talk at the ONR 2nd Workshop on Power Device Packaging Reliability, Baltimore, MD, February 26th, 2004.

G-Q. Lu, "Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices," Invited Seminar, School of Materials Science and Engineering, Nanchang University, Nanchang, China, January 2nd, 2004.

G-Q. Lu, "Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices," Invited Seminar, School of Chemical Engineering, Tianjin University, Tianjin, China, December 30th, 2004.

G-Q. Lu, "Packaging of Integrated Power Electronics Modules," invited talk at School of Electrical Engineering, ZheJiang University, China, January 3rd, 2003.

F.C. Lee, D. van Wyk, D. Borojevic, G-Q. Lu, Z. Liang, and P. Barbosa, "Technology Trends Towards a System-in-a-Module in Power Electronics," invited paper, Circuits and Systems Magazine, 2003.

G-Q. Lu, "Electronic Packaging Research at Virginia Tech," invited presentation, IMAPS Capital Chapter Meeting, Applied Physics Laboratory, March 13, 2002.

G-Q. Lu, "Integration and Packaging of Power Electronics", invited talk at School of Materials Science and Engineering, Xi’an Jiaotong University, China, June 24th, 2002.

Submitted Presentations

G. Lei, Q. Xu, J. N. Calata, S. Luo, R. A. Walker, Z. Yang, and G-Q. Lu , “Synthesis of Nanoscale Silver-Silica Composite Suspensions and Their Bactericidal Effects,” submitted to J. of Materials Research (2/2007).

J. G. Bai, J.N. Calata, G. Lei, and G-Q. Lu , “ Control of Nanosilver Sintering Attained through Organic Binder Burnout Kinetics ,” submitted to J. of Materials Research (5/2007).

T. Wang, X. Chen, G-Q. Lu , and G. Lei, ”Low-temperature Sintering with Nano Silver Paste in Die-attached Interconnection,” submitted to Journal of Electronic Materials , (4/2007).

T. Wang, G. Lei, G-Q. Lu , X. Chen, and L. Guido , “Improvement of High-Power LED Performance Using Low-Temperature Sintered Attachment,” submitted to the 9th International IEEE CPMT Symposium on High Density Design Packaging and Microsystem Integration (HDP'07) to be hold from June 26 th to 28 th in Shanghai .

G.Q. Lu, "Low-Temperature Sintering of Nanoscale Metal Paste for Attaching Semiconductor Devices,” invited talk at 2005 Materials Science and Technology Conference (MS&T'05), 9/26/2005, Pittsburgh , PA.

G-Q. Lu, “ Development of a Sintering Die-Attach Technique – a Case of Materials Research Driven by Technological Needs,” presentation at Tianjin University , 1/13/2006, Tianjin , PR China.

G-Q. Lu, “ Nanoscale Silver Paste and Its Sintering for Attaching Semiconductor Devices,” presentation at 2006 International Symposium on Advanced Packaging Materials, 3/15/2006, Atlanta , GA.

G-Q. Lu , “Integratable Materials for Power Electronics,” 2006 CPES Power Electronics Conference, Virginia Tech, April 24-26, 2006

G-Q. Lu, “Integration: the Driver that Broke Down Disciplinary Boundaries,” a lecture given to ECE sophomores taking Engineering Professional Ethics course, Virginia Tech, April 25 th , 2006.

G-Q. Lu, "Integratable Materials for Power Electronics," 2005 CPES Power Electronics Seminar, Virginia Tech, April 17-20, 2005.

G-Q. Lu, "Nanoscale Die-Attach Material for Power Electronics Packaging," School of Materials Science and Engineering, Xi'an Jiaotong University, June 25, 2005.

G-Q. Lu, "Integratable Materials for Power Electronics," 2004 CPES Power Electronics Seminar, Virginia Tech, April 18-20, 2004.

G-Q. Lu, "Integratable Materials for Power Electronics," CPES Site Visit, April 21, 2004.

G-Q. Lu, "Development of a Sintering Die-Attach Technique – a Case of Materials Research Driven by Technological Needs," MSE Department Seminar, Virginia Tech, April 1, 2004.

G-Q. Lu, "Electromagnetic Modeling and Experiment for Integration of Magneto-Optic current Sensors in Power Electronics Modules," presentation at the Technical Exchange Day, jointly planned by Virginia Tech and NSWCDD, Dahlgren, Va., April 12, 2002.

Z. Zhang and G-Q. Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow," the Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing HDP’02, 41 – 44, Shanghai, PR China, June 30–July 3, 2002.

Software and Patents

G-Q. Lu and X. Liu, "Low-cost Three-D Flip-chip Packaging Technology for Integrated Power Electronics Modules," U.S. Patent 6,442,033, August 27, 2002.

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